1.3M SWIR Camera
- Brand: DGMV
- Type: SIR1280TI-U3
Main features:
1. Adopting Sony high-resolution SWR global exposure chip, with fast frame rate.
2. It adopts a large-sized all metal shell for heat dissipation and low-power design.3. On board cache and scientific grade TEC cooling, with optional 1030-1800nm filters.
4. Provide a complete SDK development package that supports Win32 Winrt/Linux/macos.
5. which can completely replaced the SWIR Camera, such as: Acuros 0640 USB3-0.
Application industry:
Internal cracks in photovoltaic silicon wafers, solar cell wafers, semiconductors, etc. Defect detection: food (such as apples, pears, and other fruits for internal decay), medical (such as human or animal skin or other biological tissues for pathological changes), and other testing.
Camera Dimension:
Technical Parameter
Model
①SIR1280TI-U3 (built-in scientific refrigeration);
②SIR1280TO-U3(without refrigeration)
Sensor Model
Sony IMX990
Pixel (target plane) Size
5.0 * 50μm (1/2 ")
Frame Rate&Resolution
132fps@1280 * 1024、253fps@640 *512
Conversion Gain
44.3 (e -/ADU)
Read Noise
211 (e -)
Full well charge
181.6 (ke–)
Dynamic range and signal-to-noise ratio
58.7dB、52.6dB
Sensitivity and Dark Current
121mV, 383e/s
Gain Range
1-15x
Exposure Time Range
50us-60sec
Shutter Type
Global shutter
Binning Mode
Software 2×2,3×3,4×4
Data Interface
USB3.0 (USB3.1 GEN1)
Digital IO
1 optocoupler isolated input, 1 optocoupler isolated output,
and 2 non isolated input output ports.
Data Format
Mono8/Mono 12
Power Consumption, Power Supply
①25W (cooling) @ USB3.0 interface power supply/DC12Vpower supply
②2.1W (non cooling) @ USB3.0 interface power supply/DC12V power supply
Weight and Size
380g、L80*W80*H45.5mm
Lens Interface
C-mount
Software Platform
Complete SDK development package, compatible with Win32/ WinRT/Linux/macOS/Android
